JPS6347266B2 - - Google Patents

Info

Publication number
JPS6347266B2
JPS6347266B2 JP21046281A JP21046281A JPS6347266B2 JP S6347266 B2 JPS6347266 B2 JP S6347266B2 JP 21046281 A JP21046281 A JP 21046281A JP 21046281 A JP21046281 A JP 21046281A JP S6347266 B2 JPS6347266 B2 JP S6347266B2
Authority
JP
Japan
Prior art keywords
terminals
conductor
terminal
thyristor
electrode terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP21046281A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58112354A (ja
Inventor
Atsushi Maruyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP21046281A priority Critical patent/JPS58112354A/ja
Publication of JPS58112354A publication Critical patent/JPS58112354A/ja
Publication of JPS6347266B2 publication Critical patent/JPS6347266B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49548Cross section geometry
    • H01L23/49551Cross section geometry characterised by bent parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Thyristors (AREA)
  • Rectifiers (AREA)
JP21046281A 1981-12-25 1981-12-25 サイリスタ用接続導体 Granted JPS58112354A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21046281A JPS58112354A (ja) 1981-12-25 1981-12-25 サイリスタ用接続導体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21046281A JPS58112354A (ja) 1981-12-25 1981-12-25 サイリスタ用接続導体

Publications (2)

Publication Number Publication Date
JPS58112354A JPS58112354A (ja) 1983-07-04
JPS6347266B2 true JPS6347266B2 (en]) 1988-09-21

Family

ID=16589728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21046281A Granted JPS58112354A (ja) 1981-12-25 1981-12-25 サイリスタ用接続導体

Country Status (1)

Country Link
JP (1) JPS58112354A (en])

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59110146A (ja) * 1982-12-16 1984-06-26 Toshiba Corp パツケ−ジ形モジユ−ルの外部引出し端子
JP2513079B2 (ja) * 1990-11-02 1996-07-03 三菱電機株式会社 インテリジェントパワ―モジュ―ルの製造方法
JP3168901B2 (ja) * 1996-02-22 2001-05-21 株式会社日立製作所 パワー半導体モジュール
JP3006585B2 (ja) 1998-06-01 2000-02-07 富士電機株式会社 半導体装置
EP1336990A1 (de) * 2002-02-14 2003-08-20 Abb Research Ltd. Gehäuse für ein hochspannungsfestes Leistungshalbleitermodul

Also Published As

Publication number Publication date
JPS58112354A (ja) 1983-07-04

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